Coupling capacitance extraction in through-silicon via (TSV) arrays

Authors

Tarek Ramadan, Mentor Graphics Corporation
Eslam Yahya, American University in Cairo
Mohamed Dessouky, Mentor Graphics Corporation
Yehea Ismail, American University in CairoFollow

Files

Department

Electronics & Communications Engineering Department

Abstract

[abstract not available]

Publication Date

3-23-2016

Document Type

Book Chapter

Book Title

Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems

ISBN

SCOPUS_ID:84964870250

Publisher

IEEE

City

Cairo, Egypt

First Page

470

Last Page

473

Keywords

2.5D-IC, 3D-IC, SiP, TSV

Recommended Citation

APA Citation

Ramadan, T. Yahya, E. Dessouky, M. & Ismail, Y. (2016).Coupling capacitance extraction in through-silicon via (TSV) arrays. IEEE. , 470-473
https://fount.aucegypt.edu/faculty_book_chapters/371

MLA Citation

Ramadan, Tarek, et al. Coupling capacitance extraction in through-silicon via (TSV) arrays. IEEE, 2016.pp. 470-473
https://fount.aucegypt.edu/faculty_book_chapters/371