Coupling capacitance extraction in through-silicon via (TSV) arrays

Authors

Tarek Ramadan, Mentor Graphics Corporation
Eslam Yahya, American University in Cairo
Mohamed Dessouky, Mentor Graphics Corporation
Yehea Ismail, American University in CairoFollow

Files

Department

Electronics & Communications Engineering Department

Abstract

[abstract not available]

Publication Date

3-23-2016

Document Type

Book Chapter

Book Title

Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems

ISBN

SCOPUS_ID:84964870250

Publisher

IEEE

City

Cairo, Egypt

First Page

470

Last Page

473

Keywords

2.5D-IC, 3D-IC, SiP, TSV

Recommended Citation

APA Citation

Ramadan, T. Yahya, E. Dessouky, M. & Ismail, Y. (2016). Coupling capacitance extraction in through-silicon via (TSV) arrays. Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems (pp. 470-473). IEEE.

MLA Citation

Ramadan, Tarek, et al. "Coupling capacitance extraction in through-silicon via (TSV) arrays." Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems, IEEE, 2016. pp. 470-473