Low thermal-budget silicon sealed-cavity microencapsulation process

Authors

S. Sedky, American University in CairoFollow
H. Tawfik, American University in Cairo
A. Abdel Aziz, American University in Cairo
S. ElSaegh, American University in Cairo
A. B. Graham, Stanford University

Files

Department

Physics Department

Abstract

[abstract not available]

Publication Date

4-13-2011

Document Type

Book Chapter

Book Title

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

ISBN

SCOPUS_ID:79953767418

Publisher

IEEE

City

Cancun, Mexico

First Page

276

Last Page

279

Recommended Citation

APA Citation

Sedky, S. Tawfik, H. Abdel Aziz, A. ElSaegh, S. & Graham, A. (2011).Low thermal-budget silicon sealed-cavity microencapsulation process. IEEE. , 276-279
https://fount.aucegypt.edu/faculty_book_chapters/718

MLA Citation

Sedky, S., et al. Low thermal-budget silicon sealed-cavity microencapsulation process. IEEE, 2011.pp. 276-279
https://fount.aucegypt.edu/faculty_book_chapters/718