Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays

Authors

Kareem Ali, American University in Cairo
Eslam Yahya, American University in Cairo
Alaa Elrouby, Cairo University, Faculty of Engineering
Yehea Ismail, American University in CairoFollow

Files

Department

Electronics & Communications Engineering Department

Description

[abstract not available]

Publication Date

12-9-2015

Document Type

Book Chapter

Book Title

5th International Conference on Energy Aware Computing Systems and Applications, ICEAC 2015

ISBN

SCOPUS_ID:84963571400

Publisher

IEEE

City

Cairo, Egypt

First Page

33

Last Page

36

Keywords

3DIC, SiP and SoC, TSV

Recommended Citation

APA Citation

Ali, K. Yahya, E. Elrouby, A. & Ismail, Y. (2015).Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays. IEEE. , 33-36
https://fount.aucegypt.edu/faculty_book_chapters/401

MLA Citation

Ali, Kareem, et al. Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays. IEEE, 2015.pp. 33-36
https://fount.aucegypt.edu/faculty_book_chapters/401