
Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays
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Department
Electronics & Communications Engineering Department
Abstract
[abstract not available]
Publication Date
12-9-2015
Document Type
Book Chapter
Book Title
5th International Conference on Energy Aware Computing Systems and Applications, ICEAC 2015
ISBN
SCOPUS_ID:84963571400
Publisher
IEEE
City
Cairo, Egypt
First Page
33
Last Page
36
Keywords
3DIC, SiP and SoC, TSV
Recommended Citation
APA Citation
Ali, K.
Yahya, E.
Elrouby, A.
&
Ismail, Y.
(2015). Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays. 5th International Conference on Energy Aware Computing Systems and Applications, ICEAC 2015 (pp. 33-36). IEEE.
MLA Citation
Ali, Kareem, et al.
"Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays." 5th International Conference on Energy Aware Computing Systems and Applications, ICEAC 2015, IEEE, 2015. pp. 33-36